HEAT SINK COMPOUND, silicone based, 100 g

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HEAT SINK COMPOUND, silicone based, 100 g

 

Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components.


FEATURES
- High thermal conductivity.
- Excellent moisture buffer.
- Low metallic impurity content.

 

APPLICATIONS
- Printed circuit boards.
- Electronic components.
- Control assemblies.

 

Content: 100 g

Main category >Kontakt Chemie >Specialties
net 14 261 Ft+ VAT 3 850 Ft = brutto 18 111 Ft
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Article No.
A-HSC-100
Status
NEW    
WebShop System
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