AG Copper heat condustive pasta, 1,5ml.

-24%
Inventory: 2 pcs
AG Copper heat condustive pasta, 1,5ml.
AG Copper heat condustive pasta, 1,5ml.
AG Copper heat condustive pasta, 1,5ml.
AG Copper heat condustive pasta, 1,5ml.
AG Copper heat condustive pasta, 1,5ml.
AG Copper heat condustive pasta, 1,5ml.

Copper-based heat conducting paste filling the processor-radiator connections to improve cooling. Thermal
conductivity ~ 3.1 W/mK.
Application:
filling the processor-radiator connections,
not suitable for aluminium radiators,
does not conduct electricity.

 

Packaging: 1,5ml.

Other packaging please ask:

14ml.

Main Category >Soldering >Heat conductive pastas, greases
net 864 Ft+ VAT 233 Ft = brutto 1 097 Ft
Sale: net 655 Ft+ VAT 177 Ft = brutto 832 Ft
Start date: 05/11/2025   While supplies last
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Inventory
2 pcs
Item number
A-T060
WebShop System
barion_com