HEAT SINK COMPOUND, silicone based, 100 g

 
 
HEAT SINK COMPOUND, silicone based, 100 g

 

Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components.


FEATURES
- High thermal conductivity.
- Excellent moisture buffer.
- Low metallic impurity content.

 

APPLICATIONS
- Printed circuit boards.
- Electronic components.
- Control assemblies.

 

Content: 100 g

Please contact us for quantities or distributor discount! :
Please contact us for quantities or distributor discount!
Main category >Kontakt Chemie >Specialties
net 14 261 Ft+ VAT 3 850 Ft = brutto 18 111 Ft
pce
pce
Add to cart
To Favourites
Recommend
Print
Comparison
Question about the product
Similar products
Info
Similar products
HEAT SINK COMPOUND, silicone based, 20 g
HEAT SINK COMPOUND, silicone based, 20 g
net 3 980 Ft+ VAT 1 075 Ft = brutto 5 055 Ft
Silicone 72 spray, universal cleaner for electronics, fine mechanics and optics, 200 ml
Silicone 72 spray, universal cleaner for electronics, fine mechanics and optics, 200 ml
net 6 315 Ft+ VAT 1 705 Ft = brutto 8 020 Ft
Info
Article No.
A-HSC-100
WebShop System
barion_com