HEAT SINK COMPOUND, silicone based, 20 g

Name: HEAT SINK COMPOUND, silicone based, 20 g
SKU: A-HSC-20
Price: 5055 HUF
Availability: InStock

-20%

Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components.

FEATURES
- High thermal conductivity.
- Excellent moisture buffer.
- Low metallic impurity content.

APPLICATIONS
- Printed circuit boards.
- Electronic components.
- Control assemblies.

Content: 20 g

Please contact us for quantities or distributor discount! :

net 4 975 Ft+ VAT 1 343 Ft = brutto 6 318 Ft

Sale: net 3 980 Ft+ VAT 1 075 Ft = brutto 5 055 Ft

Start date: 04/12/2020 While supplies last

pce

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Data

Inventory

2 pce

Item number

A-HSC-20