HEAT SINK COMPOUND, silicone based, 20 g

-20%
Stock: 3 pce
 
 
HEAT SINK COMPOUND, silicone based, 20 g

 

Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components.


FEATURES
- High thermal conductivity.
- Excellent moisture buffer.
- Low metallic impurity content.

 

APPLICATIONS
- Printed circuit boards.
- Electronic components.
- Control assemblies.

 

Content: 20 g

Please contact us for quantities or distributor discount! :
Please contact us for quantities or distributor discount!
Main category >Kontakt Chemie >Specialties
net 4 975 Ft+ VAT 1 343 Ft = brutto 6 318 Ft
Discount: net 3 980 Ft+ VAT 1 075 Ft = brutto 5 055 Ft
Begin: 04/12/2020   While stocks last!
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Stock
3 pce
Article No.
A-HSC-20
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